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This book is the first to give an authoritative and comprehensive account of the invention of Integrated Circuits (ICs) from an insider who had participated and contributed from the beginning of their invention and advancement to the Ultra Large Scale ICs (ULSICs) of today. It reads like a mystery novel to engross the reader, but it is not based on fiction; it gives documented facts of the invention of ICs, analyzes the patents, and highlights additional details and clarifications of their history. In addition, the book clarifies the Nobel Prize award and raises intriguing questions which as yet remain unanswered even after about half a century since the ICs were invented. This is the invention which has revolutionized the whole world forever!
Two proximity fuzes under development at the Harry Diamond Laboratories use thick-film hybrid integrated circuits. A survey of the hybrid integrated circuit industry was conducted to determine its capability to produce these circuits in volume within the continental United States. The circuits as complex as those used in XM587 and XM734 fuzes are in volume production using certain types of automation. (Author).
The book opens a magic miniature world of electronics to the reader. The book addresses what small means in terms of electronics and what clean means in terms of modern electronic technology. Consequently, the reader understands why the most advanced civilization of the ancient world – the Egyptians – was not capable to do electronics. The book also discusses functionalities of the low-voltage electronic components with the aim to implement them in electronic circuit design. At the same time, it also opens the space of electronic component design to the readers be it discrete or integrated. The book has an introduction section, 11 chapters, an appendix, index, and list of literature. Appendix A discusses a set of solved problems, Appendix B presents SPICE simulation examples, and Appendix C presents component numbering in marketing environment.
"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies."
This book provides a basic understanding of the design guidelines for a wide range of hybrid circuits, both thick and thin film, covering a wide range of frequencies. It is intended for electronic engineering designers and design managers who seek a background in hybrid technology.
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"An ideal text-reference for professionals and students in electrical engineering, electro-optic engineering, and computer chip design..."--back cover.
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