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Introduction to Subsurface Imaging
Describing and evaluating the basic principles and methods of subsurface sensing and imaging, Introduction to Subsurface Imaging is a clear and comprehensive treatment that links theory to a wide range of real-world applications in medicine, biology, security and geophysical/environmental exploration. It integrates the different sensing techniques (acoustic, electric, electromagnetic, optical, x-ray or particle beams) by unifying the underlying physical and mathematical similarities, and computational and algorithmic methods. Time-domain, spectral and multisensor methods are also covered, whilst all the necessary mathematical, statistical and linear systems tools are given in useful appendices to make the book self-contained. Featuring a logical blend of theory and applications, a wealth of color illustrations, homework problems and numerous case studies, this is suitable for use as both a course text and as a professional reference.
Biological Response Modifiers — Interferons, Double-Stranded RNA and 2′,5′-Oligoadenylates
Biological response modifiers are increasingly used in viral and cancer therapy. Since alterations of the immune system are the primary symptoms of HIV infection, especially therapies directed towards the modulation of the immune response have been under intense evaluation. This volume summarizes current knowledge of the interferon-based natural antiviral protection system including 2',5'-oligoadenylate and double-stranded RNA. It will also help to develop further a solid scientific rationale for the practical use of heterologous immunomodulators in the clinics.
3D Microelectronic Packaging
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Fundamentals of Speaker Recognition
An emerging technology, Speaker Recognition is becoming well-known for providing voice authentication over the telephone for helpdesks, call centres and other enterprise businesses for business process automation. "Fundamentals of Speaker Recognition" introduces Speaker Identification, Speaker Verification, Speaker (Audio Event) Classification, Speaker Detection, Speaker Tracking and more. The technical problems are rigorously defined, and a complete picture is made of the relevance of the discussed algorithms and their usage in building a comprehensive Speaker Recognition System. Designed as a textbook with examples and exercises at the end of each chapter, "Fundamentals of Speaker Recognition" is suitable for advanced-level students in computer science and engineering, concentrating on biometrics, speech recognition, pattern recognition, signal processing and, specifically, speaker recognition. It is also a valuable reference for developers of commercial technology and for speech scientists. Please click on the link under "Additional Information" to view supplemental information including the Table of Contents and Index.
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