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Built-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design
With the end of Dennard scaling and Moore’s law, IC chips, especially large-scale ones, now face more reliability challenges, and reliability has become one of the mainstay merits of VLSI designs. In this context, this book presents a built-in on-chip fault-tolerant computing paradigm that seeks to combine fault detection, fault diagnosis, and error recovery in large-scale VLSI design in a unified manner so as to minimize resource overhead and performance penalties. Following this computing paradigm, we propose a holistic solution based on three key components: self-test, self-diagnosis and self-repair, or “3S” for short. We then explore the use of 3S for general IC designs, general-pu...
Green, Pervasive, and Cloud Computing
This book, LNCS 15225, constitutes the refereed proceedings of the 19th International Conference on Green, Pervasive, and Cloud Computing, GPC 2024, which took place in Macao, China, during September 27–30, 2024. The 13 full papers were carefully reviewed and selected from 33 submissions. They were organized in topical sections as follows: Cyber-Physical-Social Systems; Edge Intelligence; Industrial Digitization and Applications; Mobile Sensing and Computing; and Wireless and Ubiquitous Networking.
Three-Dimensional Integrated Circuit Design
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gat...
A Confucian Analysis on the Evolution of Chinese Patent Law System
This book comprehensively discusses the main features of the Chinese patent law system, which not only legally ‘transplants’ international treaties into the Chinese context, but also maintains China’s legal culture and promotes domestic economic growth. This is the basis for encouraging creativity and improving patent law protection in China. The book approaches the evolution of the Chinese patent system through the ancient Chinese philosopher Confucius’s classic principle, offering readers a fresh new way to understand and analyze Chinese patent law reforms, while also outlining how Confucian insights could be used to improve the enforcement of patent law and overall intellectual pr...
Three Dimensional System Integration
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Advanced Computer Architecture
This book constitutes the refereed proceedings of the 12th Annual Conference on Advanced Computer Architecture, ACA 2018, held in Yingkou, China, in August 2018. The 17 revised full papers presented were carefully reviewed and selected from 80 submissions. The papers of this volume are organized in topical sections on: accelerators; new design explorations; towards efficient ML/AI; parallel computing system.
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