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TMS 2025 154th Annual Meeting & Exhibition Supplemental Proceedings
  • Language: en
  • Pages: 1675

TMS 2025 154th Annual Meeting & Exhibition Supplemental Proceedings

This collection presents papers from the 154th Annual Meeting & Exhibition of The Minerals, Metals & Materials Society.

Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
  • Language: en
  • Pages: 476
Semiconductor Wafer Bonding : Science, Technology, and Applications V
  • Language: en
  • Pages: 498
Principles Of Solar Cells: Connecting Perspectives On Device, System, Reliability, And Data Science
  • Language: en
  • Pages: 541

Principles Of Solar Cells: Connecting Perspectives On Device, System, Reliability, And Data Science

How does a solar cell work? How efficient can it be? Why do intricate patterns of metal lines decorate the surface of a solar module? How are the modules arranged in a solar farm? How can sunlight be stored during the day so that it can be used at night? And, how can a lifetime of more than 25 years be ensured in solar modules, despite the exposure to extreme patterns of weather? How do emerging machine-learning techniques assess the health of a solar farm? This practical book will answer all these questions and much more.Written in a conversational style and with over one-hundred homework problems, this book offers an end-to-end perspective, connecting the multi-disciplinary and multi-scale...

Silicon Materials Science and Technology
  • Language: en
  • Pages: 800

Silicon Materials Science and Technology

  • Type: Book
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  • Published: 1998
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  • Publisher: Unknown

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Wafer Bonding
  • Language: en
  • Pages: 510

Wafer Bonding

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Site Selection
  • Language: en
  • Pages: 1114

Site Selection

  • Type: Book
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  • Published: 2008
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  • Publisher: Unknown

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Mechanical Properties and Performance of Engineering Ceramics II, Volume 27, Issue 2
  • Language: en
  • Pages: 801

Mechanical Properties and Performance of Engineering Ceramics II, Volume 27, Issue 2

This volume contains over 70 papers on advanced research and development of processing, mechanical properties and mechanics of ceramics and composites from the proceedings of the 30th International Conference on Advanced Ceramics and Composites, January 22-27, 2006, in Cocoa Beach, Florida. The conference was organized and sponsored by The American Ceramic Society and The American Ceramic Society's Engineering Ceramics Division in conjunction with the Nuclear and Environmental Technology Division. It covers underlying fundamental links between microstructure and properties, and the ability to achieve desired multifunctional properties through innovative processing techniques.

Microelectromechanical Systems: Volume 1139
  • Language: en
  • Pages: 272

Microelectromechanical Systems: Volume 1139

Microelectromechanical systems (MEMS) have transitioned from a technology niche to a role of major industrial significance. The worldwide market for MEMS is now approximately $10 billion, and the total value of systems enabled by MEMS is several orders of magnitude higher than this figure. As the market has grown, the material and process sets have broadened and departed from their semiconductor roots. In addition to engineering materials, there is now great interest in integrating multifunctional nanomaterials, smart materials and biomaterials within MEMS/NEMS to enhance functionality, performance and reliability. The opportunities created by this integration have generated a vibrant research community working on new materials and processes. This book reflects the breadth of topics currently under investigation in the field. Novel materials and accompanying processes are discussed, as are more conventional materials and processes. Consistent themes are the need for accurate material property assessment at the relevant length scales and for suitable metrology tools to support the introduction of new materials.

Meeting Abstracts
  • Language: en
  • Pages: 1534

Meeting Abstracts

  • Type: Book
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  • Published: 1998
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  • Publisher: Unknown

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