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Unified Constitutive Equations for Creep and Plasticity
Constitutive equations refer to 'the equations that constitute the material response' at any point within an object. They are one of the ingredients necessary to predict the deformation and fracture response of solid bodies (among other ingredients such as the equations of equilibrium and compatibility and mathematical descriptions of the configuration and loading history). These ingredients are generally combined together in complicated computer programs, such as finite element analyses, which serve to both codify the pertinent knowledge and to provide convenient tools for making predictions of peak stresses, plastic strain ranges, crack growth rates, and other quantities of interest. Such ...
Workforce Education
A roadmap for how we can rebuild America's working class by transforming workforce education and training. The American dream promised that if you worked hard, you could move up, with well-paying working-class jobs providing a gateway to an ever-growing middle class. Today, however, we have increasing inequality, not economic convergence. Technological advances are putting quality jobs out of reach for workers who lack the proper skills and training. In Workforce Education, William Bonvillian and Sanjay Sarma offer a roadmap for rebuilding America's working class. They argue that we need to train more workers more quickly, and they describe innovative methods of workforce education that are being developed across the country.
Global Warming, Natural Hazards, and Emergency Management
Scientists predict the earth is facing 40-to-60 years of climate change, even if emissions of carbon dioxide and other global warming gases stopped today. One inevitable consequence of the greenhouse gases already in the atmosphere will be an increase in the frequency and severity of natural disaster events. Global Warming, Natural Hazards, and Eme
Lead-free Soldering Process Development and Reliability
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessm...
Lead-Free Soldering
The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with th...
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Intermetallic Matrix Composites III: Volume 350
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource...
