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Lead-Free Solder Process Development
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin...
Influence of Temperature on Microelectronics and System Reliability
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substra...
Reliability Improvement with Design of Experiment
A guide to implementing and operating a practical reliability program using carefully designed experiments to provide information quickly, efficiently and cost effectively. It emphasizes real world solutions to daily problems. The second edition contains a special expanded section demonstrating how to combine accelerated testing with design of experiments for immediate improvement.
High Temperature Electronics
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on...
The Ancestors and Allied Families of Walter Lafayette Bell and Ruth Rankin
Walter LaFayette Bell (1889-1976) was born in Butterfield, Missouri, son of Jonas Bradley Bell (1843-1931) and Martha Ann Cooper (1865-1890). He married Ruth Rankin (1900-1975), born in Jonesboro, Arkansas, daughter of James Lewis Rankin (1854-1928) and Mary Elizabeth Dawson (1860-1912). Ancestry traced to John Bell (1668-1713) who died in Surry County, Virginia and Robert Rankin (1749-1816) of the Carolinas and Kentucky, as well as many other ancestors. Ancestors, descendants and relatives lived in Illinois, Missouri, Utah, Tennessee, Kentucky, Virginia, Arkansas, Texas, Indiana, North Carolina, Wisconsin, Iowa, Mississippi, South Carolina and elsewhere.
