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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
Metalloids in Biology
Metalloids belong to class of elements that exhibit physiochemical characteristics intermediating between those of metals and non-metals. Some are quasi-essential for the overall growth and development of plants. Silicon, for instance, enhances plant structural integrity, while boron is crucial for cell wall formation, and selenium acts as an antioxidant but some are toxic, like germanium (Ge) and arsenic (As), as they threaten the soil ecosystem and human health. Metalloid toxicity hinges on their cellular concentrations ,where low levels aid plant development ,whereas high levels cause harmful effects. Thus, it is crucial to encompass the underlying detoxification mechanisms behind metallo...
Geopolymer and Green Technology
Special topic volume with invited peer reviewed papers only.
Development and Investigation of Materials Using Modern Techniques II
Selected peer-reviewed full text papers from the 3rd International Conference on Advanced Materials Characterization Techniques (AMCT 2019) Selected, peer-reviewed papers from the 3rd International Conference on Advanced Materials Characterization Techniques (AMCT 2019), July 23-24, 2019, Kangar, Malaysia
2nd International Conference on Sustainable Materials (ICoSM 2013)
Selected, peer reviewed papers from the 2nd International Conference on Sustainable Materials (ICoSM 2013), March 26-27, 2013, Penang, Malaysia
